书籍详情
超摩尔时代电子封装建模、分析、设计与测试
作者：张恒运（Hengyun Zhang） 著
出版社：化学工业出版社
出版时间：2021-03-01
ISBN：9787122379528
定价：¥398.00
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内容简介
本书系统介绍了超摩尔时代先进封装理论模型、分析与新的模拟结果。内容涉及2.5D、3D、晶圆级封装的电性能、热性能、热机械性能、散热问题、可靠性问题、电气串扰等问题，提出了基于多孔介质体积平均理论的建模方法并应用于日渐复杂的先进封装结构，以及模型验证、设计和测试，并从原理到应用对封装热传输进行了很好的介绍。同时，引入并分析了碳纳米管、金刚石镀层、石墨烯等新材料的应用性能。本书针对产品开发阶段封装的热管理和应力管理方面进行了详细阐述，在封装性能测试、蒸汽层散热器、微槽道冷却、热电制冷等方面也有涉及。相应的试验测试和案例分析也便于读者提高对封装性能表征和评估方法的理解。 本书可作为从事微电子封装行业人员的参考资料，也可供高等院校相关专业研究生和高年级本科生学习参考。
作者简介
张恒运，上海工程技术大学教授，博士生导师，IEEE高级会员。曾任职于新加坡微电子研究院，美国超微半导体公司（新加坡）、美国道康宁公司（上海）。主持和参与新加坡先进科技局、美国DARPA、上海科委、自然科学基金、跨国公司项目近20项，发表论文80多篇，GOOGLE Scholar引用率1000次。授予美国、新加坡发明专利和中国发明、实用新型专利共30多项。车法星，新加坡微电子研究院研究员。曾就职于UTAC，意法半导体，英飞凌公司。发表论文120多篇，Google Scholar引用率近2000次。林挺宇，无锡华进半导体研究所技术总监。曾任职于朗讯、飞利浦、摩托罗拉等公司和微电子研究院担任高级经理等职务，参与超过100项电子产品开发工作，发表论文150多篇，申请、授予专利10多项，主导两项关于TSV的ASTM国际标准。赵文生，IEEE高级会员，杭州电子科技大学副教授，发表论文70多篇。
目录
Preface vii
Acknowledgments xi
About the authors xiii
1Introduction 1
1.1Evolution of integrated circuit packaging 1
1.2Performance and design methodology for integrated circuit packaging 6
References 11
Further reading 12
2Electrical modeling and design 13
2.1Fundamental theory13
2.2Modeling, characterization, and design of through-silicon via packages 28
References 53
3Thermal modeling, analysis, and design 59
3.1Principles of thermal analysis and design 59
3.2Package-level thermal analysis and design 74
3.3Numerical modeling 89
3.4Package-level thermal enhancement 97
3.5Air cooling for electronic devices with vapor chamber configurations 101
3.6Liquid cooling for electronic devices 106
3.7Thermoelectric cooling 112
References 126
4Stress and reliability analysis for interconnects 131
4.1Fundamental of mechanical properties 131
4.2Reliability test and analysis methods 149
4.3Case study of design-for-reliability 227
References 239
5Reliability and failure analysis of encapsulated packages 245
5.1Typical integrated circuit packaging failure modes 245
5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245
5.3Thermal- and moisture-induced stress analysis 263
5.4Fracture mechanics analysis in integrated circuits package 270
5.5Reliability enhancement in PBGA package 282
References 290
Further reading 292
6Thermal and mechanical tests for packages and materials 293
6.1Package them叫tests 293
6.2Material mechanical test and characterization 306
References 322
7System-level modeling, analysis, and design 325
7.1System-level them叫modeling and design 325
7.2Mechanical modeling and design for microcooler system 348
7.3Codesign modeling and analysis for advanced packages 370
References 389
Appendix 1 Nomenclature 393
Appendix 2 Conversion factors 403
Index 405
Acknowledgments xi
About the authors xiii
1Introduction 1
1.1Evolution of integrated circuit packaging 1
1.2Performance and design methodology for integrated circuit packaging 6
References 11
Further reading 12
2Electrical modeling and design 13
2.1Fundamental theory13
2.2Modeling, characterization, and design of through-silicon via packages 28
References 53
3Thermal modeling, analysis, and design 59
3.1Principles of thermal analysis and design 59
3.2Package-level thermal analysis and design 74
3.3Numerical modeling 89
3.4Package-level thermal enhancement 97
3.5Air cooling for electronic devices with vapor chamber configurations 101
3.6Liquid cooling for electronic devices 106
3.7Thermoelectric cooling 112
References 126
4Stress and reliability analysis for interconnects 131
4.1Fundamental of mechanical properties 131
4.2Reliability test and analysis methods 149
4.3Case study of design-for-reliability 227
References 239
5Reliability and failure analysis of encapsulated packages 245
5.1Typical integrated circuit packaging failure modes 245
5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245
5.3Thermal- and moisture-induced stress analysis 263
5.4Fracture mechanics analysis in integrated circuits package 270
5.5Reliability enhancement in PBGA package 282
References 290
Further reading 292
6Thermal and mechanical tests for packages and materials 293
6.1Package them叫tests 293
6.2Material mechanical test and characterization 306
References 322
7System-level modeling, analysis, and design 325
7.1System-level them叫modeling and design 325
7.2Mechanical modeling and design for microcooler system 348
7.3Codesign modeling and analysis for advanced packages 370
References 389
Appendix 1 Nomenclature 393
Appendix 2 Conversion factors 403
Index 405
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