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电子科学与技术专业英语（微电子技术分册）
作者：张爱红总主编；陈伟平，田丽主编
出版社：哈尔滨工业大学出版社
出版时间：2003-06-01
ISBN：9787560318332
定价：¥19.80
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内容简介
《电子科学与技术专业英语（微电子技术分册）（修订版）》由半导体物理、半导体器件、半导体与集成电路工艺、集成电路设计、微电子机械系统和科技文献范例六部分组成。全书涵盖了微电子技术领域的基本内容，同时又介绍了该领域的一些较新的发展。《电子科学与技术专业英语（微电子技术分册）（修订版）》可作为电子科学与技术专业微电子技术方向的三、四年级本科生的专业英语教材，也可供相关专业的本科生和从事该专业领域的工程技术人员使用。
作者简介
暂缺《电子科学与技术专业英语（微电子技术分册）》作者简介
目录
Chapter 1 Semiconductors Physics
1.1 Energy Bands and Carrier Concentration
1.2 Carrier Transport Phenomena
1.3 PN Junction
1.4 Summary
参考文献
Chapter 2 Semiconductor Device
2.1 Bipolar Junction Transistor
2.2 The MOSFET
2.3 Microwave and Photonie Devices
2.4 Summary
参考文献
Chapter 3 Processing Tedmology
3.1 Crystal Growth and Epitaxy
3.2 Crystal Growth from the Melt
3.3 Vaper-Phase Epitaxy
3.4 Oxidation and Film Deposition
3.5 Diffusion and Ion Implantation
3.6 Lithographies
3.7 Wet Chemical Etching
3.8 Dry Etching
3.9 Integrated Devices
3.10 Fundamental Limits of Integrated Devices
参考文献
Chapter 4 Integrated Circuits
4.1 Introduction
4.2 Design Analysis and Simulation
4.3 Verification
4.4 Sunmaary
参考文献
Chapter 5 Microelectromechanical Systems (MEMS)
5.1 Introduction
5.2 MEMS
5.3 Mechanical Characteristics of Silicon
5.4 Micmfabrications for MEMS
5.5 Micmsensing for MEMS
5.6 Electmmechanical Actuation
5.7 Materials for MEMS
参考文献
Chapter 6 Examples of Scientific and Technological Papers
6.1 The Challenges for Physical Limitations in Si Microelectrc
6.2 Microelectronics and Photonlcs - the Future
6.3 Accelerated Verification of Digital Devices Using VHDL
6.4 What Is Nanoteehnology
参考文献
1.1 Energy Bands and Carrier Concentration
1.2 Carrier Transport Phenomena
1.3 PN Junction
1.4 Summary
参考文献
Chapter 2 Semiconductor Device
2.1 Bipolar Junction Transistor
2.2 The MOSFET
2.3 Microwave and Photonie Devices
2.4 Summary
参考文献
Chapter 3 Processing Tedmology
3.1 Crystal Growth and Epitaxy
3.2 Crystal Growth from the Melt
3.3 Vaper-Phase Epitaxy
3.4 Oxidation and Film Deposition
3.5 Diffusion and Ion Implantation
3.6 Lithographies
3.7 Wet Chemical Etching
3.8 Dry Etching
3.9 Integrated Devices
3.10 Fundamental Limits of Integrated Devices
参考文献
Chapter 4 Integrated Circuits
4.1 Introduction
4.2 Design Analysis and Simulation
4.3 Verification
4.4 Sunmaary
参考文献
Chapter 5 Microelectromechanical Systems (MEMS)
5.1 Introduction
5.2 MEMS
5.3 Mechanical Characteristics of Silicon
5.4 Micmfabrications for MEMS
5.5 Micmsensing for MEMS
5.6 Electmmechanical Actuation
5.7 Materials for MEMS
参考文献
Chapter 6 Examples of Scientific and Technological Papers
6.1 The Challenges for Physical Limitations in Si Microelectrc
6.2 Microelectronics and Photonlcs - the Future
6.3 Accelerated Verification of Digital Devices Using VHDL
6.4 What Is Nanoteehnology
参考文献
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